*****A*****
Abietic Acid松脂酸.
Abrasion Resistance耐磨性.
Abrasives磨料,刷材.
ABS樹脂.
Absorption吸收(入).
Ac Impedance交流阻抗.
Accelerated Test(Aging)加速老化(試驗(yàn)).
Acceleration速化反應(yīng).
Accelerator 加速劑,速化劑.
Acceptability,Acceptance 允收性,允收.
Access Hole露出孔,穿露孔.
Accuracy準(zhǔn)確度.
Acid Number (Acid Value)酸值.
Acoustic Microscope (AM)感音成像顯微鏡.
Acrylic壓克力(聚丙烯酸樹脂).
Actinic Light (or Intensity, or Radiation)有效光.
Activation活化.
Activator活化劑.
Active Carbon活性炭.
Active Parts(Devices)主動零件.
Acutance解像銳利度.
Addition Agent添加劑.
Additive Process加成法.
Adhesion附著力.
Adhesion Promotor附著力促進(jìn)劑.
Adhesive膠類或接著劑.
Admittance導(dǎo)納(阻抗的倒數(shù)).
Aerosol噴霧劑,氣熔膠,氣懸體.
Aging老化.
Air Inclusion氣泡夾雜.
Air Knife風(fēng)刀.
Algorithm算法.
Aliphatic Solvent脂肪族溶劑.
Aluminium Nitride(AlN)氮化鋁.
Ambient Tamp環(huán)境溫度.
Amorphous無定形,非晶形.
Amp-Hour安培小時(shí).
Analog Circuit/Analog Signal模擬電路/模擬訊號.
Anchoring Spurs著力爪.
Angle of  Contack接觸角.
Angle of Attack攻角.
Anion陰離子.
Anisotropic異向性,單向的.
Anneal 韌化(退火).
Annular Ring孔環(huán).
Anode陽極.
Anode Sludge陽極泥.
Anodizing陽極化.
ANSI美國標(biāo)準(zhǔn)協(xié)會.
Anti-Foaming Agent消泡劑.
Anti-pit Agent抗凹劑.
AOI自動光學(xué)檢驗(yàn).
Apertures開口,鋼版開口.
AQL品質(zhì)允收水準(zhǔn).
AQL(Acceptable Quality Level)允收品質(zhì)水準(zhǔn).
Aramid Fiber聚醯胺纖維.
Arc Resistance耐電弧性.
Array排列.
Artwork底片.
ASIC特定用途績體電路器.
Aspect Ratio縱橫比.
Assembly組裝裝配.
A-stage A階段.
ATE自動電測設(shè)備.
Attenuation訊號衰減.
Autoclave壓力鍋.
Axial-lead軸心引腳.
Azeotrope共沸混合液.
                       *****B*****
Back Light (Back Lighting)背光法.
Back Taper反錐斜角.
Backpanels, Backplanes支撐板.
Back-up 墊板.
Balanced Transmission Lines平衡式傳輸線.
Ball Grid Array球腳數(shù)組(封裝).
Bandability彎曲性.
Banking Agent護(hù)岸劑.
Bare Chip Assembly裸體芯片組裝.
Barrel孔壁,滾鍍.
Base Material基材.
Basic Grid基本方格.
Batch批.
Baume波美度(凡液體比重比水重則  Be=145-(145÷Sp.Gr)
凡液體比重比水輕則  Be=140÷(Sp.Gr-130)
*Sp.Gr 為比重即同體績物質(zhì)對"純水"1g/cm的比值).
Beam lead光芒式的平行密集引腳.
Bed-of-Nail Testing針床測試.
Bellows Conact彈片式接觸.
Beta Ray Backscatter貝他射線反彈散射.
Bevelling切斜邊.
Bias斜張綱布,斜纖法.
Bi-Level Stencil]雙階式鋼板.
Binder粘結(jié)劑.
Bits頭(Drill Bits).
Black Oxide黑氧化層.
Blanking沖空斷開.
Bleack 漂洗.
Bleeding溢流.
Blind Via Hole肓通孔.
Blister局部性分層或起泡.
Block Diagram電路系統(tǒng)塊圖 .
Blockout封綱.
Blotting干印.
Blotting Paper吸水紙.
Blow Hole吹孔.
Blue Plaque藍(lán)紋(錫面鈍化層).
Blur Edge (Circle)模糊邊帶(圈).
Bomb Sight彈標(biāo).
Bond Strength結(jié)合強(qiáng)度.
Bondability結(jié)合性.
Bonding Layer結(jié)合層接著層.
Bonding Sheet(Layer)接合片.
Bonding Wire結(jié)合線.
Bow, Bowing板彎.
Braid編線.
Brazing硬焊(用含銀的銅鋅合金焊條).
在425℃~870℃下進(jìn)行熔接的方式).
Break Point顯像點(diǎn).
Break-away Panel可斷開板.
Breakdown Voltage崩潰電壓.
Break-out破出.
Bridging搭橋.
Bright Dip光澤浸漬處理.
Brightener光澤劑.
Brown Oxide棕氧化.
Brush Plating刷鍍.
B-stageB階段.
Build Up Process增層法制程.
Build-up堆積.
Bulge鼓起.
Bump 突塊.
Bumping Process凸塊制程.
Buoyancy浮力.
Buried Via Hole埋導(dǎo)孔.
Burn-in高溫加速老化試驗(yàn).
Burning燒焦.
Burr毛頭.
Bus Bar匯電桿.
Butter Coat 外表樹脂層.
                        *****C*****
C4 Chip JointC4芯片焊接.
Cable電纜.
CAD計(jì)算機(jī)輔助設(shè)計(jì).
Calendered Fabric軋平式綱布.
Cap Lamination帽式壓合法.
Capacitance電容.
Capacitive Coupling電容耦合.
Capillary Action毛細(xì)作用.
Carbide碳化物.
Carbon Arc Lamp碳弧燈.
Carbon Treatment, Active活化炭處理.
Card卡板.
Card Cages/Card Racks電路板構(gòu)裝箱.
Carlson Pin卡氏定位稍.
Carrier載體.
Cartridge濾心.
Castallation堡型績體電路器.
Catalyzed Board, Catalyzed Substrate催化板材.
Catalyzing催化.
Cathode陰極.
Cation陰向離子, 陽離子.
Caul Plate隔板.
Cavitation空泡化  半真空.
Center-to-Center Spacing中心間距.
Ceramics陶瓷.
Cermet陶金粉.
Certificate證明書.
CFC氟氫碳化物.
Chamfer倒角.
Characteristic Impedance特性阻抗.
Chase綱框.
Check List檢查清單.
Chelate螯合.
Chemical Milling化學(xué)研磨.
Chemical Resistance抗化性.
Chemisorption化學(xué)吸附.
Chip芯片(粒).
Chip Interconnection芯片互連.
Chip on Board芯片粘著板.
Chip On Glass晶玻接裝(COG).
Chisel鉆針的尖部.
Chlorinated Solvent含氯溶劑,氯化溶劑.
Circumferential Separation環(huán)狀斷孔.
Clad/Cladding披覆.
Clean Room無塵室.
Cleanliness清潔度.
Clearance余地,余環(huán).
Clinched Lead Terminal緊箝式引腳.
Clinched-wire Through Connection通孔彎線連接法 .
Clip Terminal繞線端接.
Coat, Coating皮膜表層.
Coaxial Cable同軸纜線.
Coefficient of Thermal Expansion熱膨脹系數(shù).
Co-Firing共繞.
Cold Flow冷流.
Cold Solder Joint冷焊點(diǎn).
Collimated Light平行光.
Colloid膠體.
Columnar Structure柱狀組織.
Comb Pattern梳型電路.
Complex Ion錯(cuò)離子.
Component Hole零件孔.
Component Orientation零件方向.
Component Side組件面.
Composites,(CEM-1,CEM-3)復(fù)合板材.
Condensation Soldering凝熱焊接,液化放熱焊接.
Conditioning整孔.
Conductance導(dǎo)電.
Conductive Salt導(dǎo)電鹽.
Conductivity導(dǎo)電度.
Conductor Spacing導(dǎo)體間距.
Conformal Coating貼護(hù)層.
Conformity吻合性, 服貼性.
Connector連接器.
Contact Angle接觸角.
Contact Area接觸區(qū).
Contact Resistance接觸電阻.
Continuity連通性.
Contract Service協(xié)力廠,分包廠.
Controlled Depth Drilling定深鉆孔.
Conversion Coating 轉(zhuǎn)化皮膜.
Coplanarity共面性.
Copolymer共聚物.
Copper Foil銅皮.
Copper Mirror Test銅鏡試驗(yàn).
Copper Paste銅膏.
Copper-Invar-Copper (CIC)綜合夾心板.
Core Material內(nèi)層板材,核材.
Corner Crack 通孔斷角.
Corner Mark板角標(biāo)記.
Counterboring方型擴(kuò)孔.
Countersinking錐型擴(kuò)孔.
Coupling Agent 偶合劑.
Coupon, Test Coupon板邊試樣.
Coverlay/Covercoat表護(hù)層.
Crack裂痕.
Crazing白斑.
Crease皺折.
Creep潛變.
Crossection Area截面積.
Crosshatch Testing十字割痕試驗(yàn).
Crosshatching十字交叉區(qū).
Crosslinking, Crosslinkage交聯(lián),架橋.
Crossover越交,搭交.
Crosstalk噪聲, 串訊.
Crystalline Melting Point晶體熔點(diǎn).
C-Stage C階段.
Cure硬化,熟化.
Current Density電流密度.
Current-Carrying Capability載流能力.
Curtain Coating濂涂法.
                        *****D*****
Daisy Chained Design菊瓣設(shè)計(jì).
Datum Reference基準(zhǔn)參考.
Daughter Board子板.
Debris碎屑,殘材.
Deburring去毛頭.
Declination Angle斜射角.
Definition邊緣逼真度.
Degradation 劣化.
Degrasing脫脂.
Deionized Water去離子水.
Delamination分離.
Dendritic Growth 枝狀生長.
Denier丹尼爾(是編織紡織所用各種紗類直徑單位,
定義9000米紗束所具有的重量(以克米計(jì))).
Densitomer透光度計(jì).
Dent凹陷.
Deposition 皮膜處理.
Desiccator干燥器.
Desmearing去膠渣.
Desoldering解焊.
Developer顯像液,顯像機(jī).
Developing顯像 .
Deviation偏差.
Device電子組件.
Dewetting縮錫.
D-glassD玻璃.
Diaze Film偶氮棕片.
Dichromate重鉻 酸鹽.
Dicing芯片分割.
Dicyandiamide(Dicy)雙氰胺.
Die 沖模.
Die Attach晶粒安裝.
Die Bonding晶粒接著.
Die Stamping沖壓.
Dielectric 介質(zhì).
Dielectric Breakdown Voltage介質(zhì)崩潰電壓.
Dielectric Constant介質(zhì)常數(shù).
Dielectric Strength介質(zhì)強(qiáng)度.
Differential Scanning Calorimetry(DSC)微差掃瞄熱卡分析法.
Diffusion Layer擴(kuò)散層.
Digitizing數(shù)字化.
Dihedral Angle雙反斜角.
Dimensional Stability尺度安定性.
Diode二極管.
Dip Coating浸涂法.
Dip Soldering浸焊法.
DIP(Dual Inline Package)雙排腳封裝體.
Dipole偶極,雙極.
Direct / Indirect Stencil直接/間接版膜.
Direct Emulsion直接乳膠.
Direct Plating直接電鍍.
Discrete Compenent散裝零件.
Discrete Wiring Board散線電路板,復(fù)線板.
Dish Down碟型下陷.
Dispersant分散劑.
Dissipation Factor散失因素.
Disspation Factor散逸因子.
Disturbed Joint受擾焊點(diǎn).
Doctor Blade修平刀,刮平刀.
Dog Ear狗耳.
Doping摻雜.
Double Layer雙電層.
Double Treated Foil雙面處理銅箔.
Drag In / Drag Out帶[進(jìn)/帶出.
Drag Soldering拖焊.
Drawbridging吊橋效應(yīng).
Drift漂移.
Drill Facet鉆尖切削面.
Drill Pointer鉆針重磨機(jī).
Drilled Blank已鉆孔的裸板.
Dross浮渣.
Drum Side銅箔光面.
Dry Film干膜.
Dual Wave Soldering 雙波焊接.
Ductility展性.
Dummy Land假焊墊.
Dummy, Dummying假鍍(片).
Durometer橡膠硬度計(jì).
DYCOstrate電漿蝕孔增層法.
Dynamic Flex(FPC)動態(tài)軟板.
                        *****E*****
E-Beam (Electron Beam)電子束.
Eddy Current渦電流.
Edge Spacing板邊空地.
Edge-Board Connector板邊(金手指)承接器.
Edge-Board Contact板邊金手指.
Edge-Dip Solderability Test板邊焊錫性測試.
EDTA乙二胺四乙酸.
Effluent排放物.
E-glass電子級玻璃.
Elastomer彈性體.
Electric Strength(耐)電性強(qiáng)度.
Electrodeposition電鍍.
Electro-deposition Photoresist電著光阻, 電泳光阻.
Electroforming電鑄.
Electroless-Deposition無電鍍.
Electrolytic Tough Pitch電解銅..
Electrolytic-Cleaning電解清洗.
Electro-migration電遷移.
Electro-phoresis電泳動, 電滲.
Electro-tinning鍍錫.
Electro-Winning電解冶煉.
Elongation 延伸性, 延伸率.
Embossing凸出性壓花.
EMF(Electromotive Force)電動勢.
EMI(Electromagnetic Interference)電磁干擾.
Emulsion乳化.
Emulsion Side藥膜面.
Encapsulating膠囊.
Encroachment沾污,侵犯.
End Tap封頭.
Entek有機(jī)護(hù)銅處理.
Entrapment夾雜物.
Entry Material蓋板.
Epoxy Resin環(huán)氧樹脂.
Etch Factor蝕刻因子.
Etchant蝕刻劑(液).
Etchback回蝕.
Etching Indicator蝕刻指針.
Etching Resist蝕刻阻劑.
Eutetic Composition共融組成.
Exotherm放熱(曲線).
Exposure曝光.
Eyelet鉚眼.
                        *****F*****
Fabric綱布.
Face Bonding反面朝下結(jié)合.
Failure故障.
Fan Out Wiring/Fan In Wiring扇出布線/扇入布線.
Farad 法拉.
Farady法拉第.
Fatigue Strength抗疲勞強(qiáng)度.
Fault缺陷.
Fault Plane斷層面.
Feed Through Hole導(dǎo)通孔.
Feeder 進(jìn)料器.
Fiber Exposure玻纖顯露.
Fiducial Mark基準(zhǔn)記號.
Filament纖絲.
Fill緯向.
Filler填充料.
Fillet內(nèi)圓填角.
Film底片.
Film Adhesive接著膜,粘合膜.
Filter過濾器.
Fine Line細(xì)線.
Fine Pitch密腳距,密線距,密墊距.
Fineness粒度, 純度.
Finger手指.
Finishing終修(飾).
Finite Element Method有限要素分析法.
First Article首產(chǎn)品.
First Pass-Yield初檢良品率.
Fixture夾具.
Flair刃角變形.
Flame Point自燃點(diǎn).
Flame Resistant耐燃性.
Flammability Rate燃性等級.
Flare扇形崩口.
Flash Plating閃鍍.
Flashover閃絡(luò).
Flat Cable扁平排線.
Flat Pack扁平封裝(之零件).
Flatness平坦度.
Flexible Printed Circuit (FPC)軟板.
Flexural Failure撓曲損壞.
Flexural Module彎曲模數(shù), 抗撓性模數(shù) .
Flexural Strength抗撓強(qiáng)度.
Flip Chip覆晶,扣晶.
Flocculation絮凝.
Flood Stroke Print覆墨沖程印刷.
Flow Soldering (Wave Soldering)流焊.
Fluorescence熒光.
Flurocarbon Resin碳氟樹脂.
Flush Conductor嵌入式線路  , 貼平式 導(dǎo)體.
Flush Point閃火點(diǎn).
Flute退屑槽.
Flux助焊劑.
Foil Burr銅箔毛邊.
Foil Lamination銅箔壓板法.
Foot殘足(干膜殘余物).
Foot Print (Land Pattern)腳墊.
Foreign Material 外來物,異物.
Form-to-List布線說明清單.
Four Point Twisting四點(diǎn)扭曲法.
Free Radical自由基.
Freeboard干舷.
Frequency頻率.
Frit 玻璃熔料.
Fully-Additive Process全加成法.
Fungus Resistance抗霉性.
Fused Coating熔錫層.
Fusing熔合.
Fusing Fluid助熔液.
                        *****G*****
G-10由連續(xù)玻纖所織成的玻纖布與
環(huán)氧樹脂粘結(jié)劑所復(fù)合成的材料.
Gage, Gauge量規(guī).
Gallium Arsenide (GaAs)砷化鎵.
Galvanic Corrosion賈凡尼式腐蝕(電解式腐蝕).
Galvanic Series賈凡尼次序(電動次序).
Galvanizing鍍鋅.
GAP第一面分離,長刃斷開.
Gate Array閘列,閘極數(shù)組.
Gel Time膠化時(shí)間.
Gelation Particle膠凝點(diǎn).
Gerber Data ,Gerber File格博檔案(是美商Gerber公司專為PCB面線路
圖形與孔位,所發(fā)展一系列完整的軟件檔案).
Ghost Image陰影.
Gilding鍍金 (現(xiàn)為:Glod Plating).
Glass Fiber玻纖.
Glass Fiber Protrusion/Gouging, Groove玻纖突出/挖破.
Glass Transition Temperature, Tg玻璃態(tài)轉(zhuǎn)化溫度.
Glaze釉面,釉料.
Glob Top圓頂封裝體.
Glouble Test球狀測試法.
Glycol (Ethylene Glycol)乙二醇.
Golden Board測試用標(biāo)準(zhǔn)板.
Grain Size結(jié)晶粒度.
Grass Leak 大漏.
Grid標(biāo)準(zhǔn)格.
Ground Plane /Earth Plane接地層.
Ground Plane Clearance接地空環(huán).
Guide Pin導(dǎo)針.
Gull /Wing Lead鷗翼引腳.
                        *****H*****
Halation環(huán)暈.
Half Angle半角.
Halide鹵化物.
Haloing白圈,白邊.
Halon海龍,是CFC"氟碳化物"的一種商品名.
Hard Anodizing硬陽極化.
Hard Chrome Plating鍍硬鉻.
Hard Soldering硬焊.
Hardener (Curing Agent)硬化劑(或Curing Agent).
Hardness硬度.
Haring-Blum Cell海固槽.
Harness電纜組合.
Hay Wire跳線.
Heat Cleaning燒潔.
Heat Dissipation散熱.
Heat Distortion Point (Temp)熱變形點(diǎn)(溫度).
Heat Sealing熱封.
Heat Sink Plane散熱層.
Heat Transfer Paste導(dǎo)熱膏.
Heatsink Tool散熱工具.
Hertz(Hz)赫.
High Efficiency Particulate Air Filter (HEPA)高效空氣塵粒過瀘機(jī).
Hipot Test 高壓電測.
Hi-Rel高度靠度.
Hit 擊(鉆孔時(shí)鉆針每一次"刺下"的動作).
Holding Time停置時(shí)間.
Hole Breakout孔位破出.
Hole Counter數(shù)孔機(jī).
Hole Density孔數(shù)密度.
Hole Preparation通孔準(zhǔn)備.
Hole Pull Strength孔壁強(qiáng)度.
Hole Void破洞.
Hook 切削刀緣外凸.
Hot Air Levelling噴錫.
Hot Bar Soldering熱把焊接.
Hot Gas Soldering熱風(fēng)手焊.
HTE(High Temperature Elongation)高溫延伸性.
Hull Cell哈氏槽.
Hybrid Integrated Circuit混成電路.
Hydraulic Bulge Test液壓鼓起試驗(yàn).
Hydrogen Embrittlement氫脆.
Hydrogen Overvoltage氫過(超)電壓.
Hydrolysis水解.
Hydrophilic親水性.
Hygroscopic吸濕性.
Hypersorption超吸咐.
                         *****I*****
I.C. Socket績體電路器插座.
Icicle錫尖.
Illuminance照度.
Image Transfer影像轉(zhuǎn)移.
Immersion Plating浸鍍.
Impedance阻抗.
Impedance Match阻抗匹配.
Impregnate含浸.
In-Circuit Testing組裝板電測.
Inclusion異物,夾雜物.
Indexing Hole基準(zhǔn)孔.
Inductance(L)電感.
Infrared(IR)紅外線.
Input/Output輸入/輸出.
Insert, Insertion插接.
Inspection Overlay套檢底片.
Insulation Resistance絕緣電阻.
Integrated Circuit(IC)績體電路器.
Inter Face接口.
Interconnection互連.
Intermetallic Compound (IMC)接口共化物.
Internal Stress內(nèi)應(yīng)力.
Interposer互邊導(dǎo)電物.
Interstitial Via-Hole(IVH)局部層間導(dǎo)通孔.
Invar殷鋼(63.8%Fe,36%Ni,0.2%C).
Ion Cleanliness離子清潔度.
Ion Exchange Resins離子交換樹脂.
Ion Migration離子遷移.
Ionizable (Ionic) Contaimination離子性污染.
Ionization游離,電離.
Ionization Voltage (Corona Level)電離化電壓(電纜內(nèi)部狹縫空氣中,引起其
電離所施加之最小電壓).
IPC美國印刷電路板協(xié)會.
Isolation隔離性,隔絕性.
                         *****J*****
JEDEC(Joint Electronic Device  聯(lián)合電子組件工程委員會.
Engineering Council)
J-LeadJ型接腳.
Job Shop專業(yè)工廠.
Joule焦耳.
Jumper Wire跳線.
Junction接(合)面,接頭.
Just-In-Time(JIT)適時(shí)供應(yīng),及時(shí)出現(xiàn).
                        *****K*****
Kapton聚亞醯胺軟板.
Karat克拉    (1克拉(鉆石)=0.2g   純金則24k金為
100%的鈍金.
Kauri-Butanol Value考立丁醇值(簡稱K.B.值).
Kerf.切形,裁剪.
Kevlar聚醯胺纖維.
Key電鍵
Key Board鍵盤.
Kiss Pressure吻壓, 低壓.
Knoop Hardness努普硬度.
Known Good Die(KGD)已知之良好芯片.
Kovar科伐合金(Fe53%,Ni29%,Co17%).
Kraft Paper牛皮紙.
                        *****L*****
Lamda Wave延伸平波.
Laminar Flow平流.
Laminar Structure片狀結(jié)構(gòu).
Laminate Void板材空洞.
Laminate(s)基板.
Lamination Void壓合空洞.
Laminator壓膜機(jī).
Land孔環(huán)焊墊,表面焊墊.
Landless Hole無環(huán)通孔.
Laser Direct Imaging (LDI)雷射直接成像.
Laser Maching雷射加工法.
Laser Photogenerator(LPG), Laser Photoplotter雷射曝光機(jī).
Laser Soldering雷射焊接法.
Lay Back 刃角磨損.
Lay Out布線,布局.
Lay Up 疊合.
Layer to Layer Spacing層間距離
Leaching焊散漂出,熔出.
Lead 引腳.
Lead Frame腳架.
Lead Pitch腳距.
Leakage Current漏電電流.
Legend文字標(biāo)記.
Leveling整平.
Lifted Land孔環(huán)(焊墊)浮起.
Ligand錯(cuò)離子附屬體.
Light Emitting Diodes (LED)發(fā)光二極管.
Light Integrator光能累積器.
Light Intensity光強(qiáng)度.
Limiting Current Density極限電流密度.
Liquid Crystal Display (LCD)液晶顯示器.
Liquid Dielectrics液態(tài)介質(zhì).
Liquid Photoimagible Solder Mask, (LPSM)液態(tài)感光防焊綠漆.
Local Area Network區(qū)域性網(wǎng)絡(luò).
Logic 邏輯.
Logic Circuit 邏輯電路.
Loss Factor損失因素.
Loss Tangent (TanδDK)損失正切.
Lot Size批量.
Luminance發(fā)光強(qiáng)度.
Lyophilic親水性膠體.
                       *****M*****
Macro-Throwing Power巨觀分布力.
Major Defect主要(嚴(yán)重)缺點(diǎn).
Major Weave Direction主要織向.
Margin刃帶(鉆頭尖部).
Marking標(biāo)記.
Mask阻劑.
Mass Finishing大量整面(拋光).
Mass Lamination大型壓板.
Mass Transport質(zhì)量輸送.
Master Drawing主圖.
Mat席(用于CEM-3(Composite Epoxy Material)的
復(fù)合材料.)
Matte Side毛面(電鍍銅皮(ED Foil)之粗糙面).
Mealing泡點(diǎn).
Mean Time To Failure (MTTF)故障前可用之平均時(shí)數(shù).
Measling白點(diǎn).
Mechanical Stretcher機(jī)械式張網(wǎng)機(jī).
Mechanical Warp機(jī)械式纏繞.
Mechanism機(jī)理.
Membrane Switch薄膜開關(guān).
Meniscograph Test弧面狀沾錫試驗(yàn).
Meniscus彎月面.
Mercury Vaper Lamp汞氣燈.
Mesh Count綱目數(shù).
Metal Halide Lamp 金屬鹵素?zé)?
Metallization金屬 化.
Metallized Fabric金屬化綱布.
Micelle微胞.
Micro Wire Board微封線板.
Micro-electronios微電子.
Microetching微蝕.
Microsectioning微切片法.
Microstrip 微條.
Microstrip Line微條線,微帶線.
Microthrowing Power微分布力.
Microwave微波.
Migration遷移.
Migration Rate遷移率.
Mil英絲.
Minimum Annular Ring孔環(huán)下限.
Minimum Electrical Spacing電性間距下限.
Minor Weave Direction次要織向.
Misregistration 對不準(zhǔn)度.
Mixed Componmt Mounting Technology混合零件之組裝技術(shù).
Modem調(diào)變及解調(diào)器.
Modification修改.
Module模塊.
Modulus of Elasticity彈性系數(shù).
Moisture and Insulation Resistance Test濕氣與絕緣電阻試驗(yàn).
Mold Release 脫模劑,離型劑.
Mole摩爾.
Monofilament單絲.
Mother Board主機(jī)板,母板.
Moulded Circuit模造立體電路機(jī).
Mounting Hole安裝孔.
Mounting Hole組裝孔,機(jī)裝孔.
Mouse Bite鼠齒(蝕刻后線路邊緣出現(xiàn)不規(guī)則缺口).
Multi-Chip-Module(MCM)多芯片芯片模塊.
Multiwiring Board (or Discrete Wiring Board)復(fù)線板.
                        *****N*****
N.C.數(shù)值控制.
Nail Head釘頭.
Near IR近紅外線.
Negative負(fù)片,鉆尖的第一面外緣變窄.
Negative Etch-back反回蝕.
Negative Stencil負(fù)性感光膜.
Negative-Acting Resist負(fù)性作用之阻劑.
Network綱狀元件.
Newton牛頓.
Newton Ring 牛頓環(huán).
Newtonian Liquid牛頓流體.
Nick缺口.
N-Methyl Pyrrolidine (NMP)N-甲基四氫嗶咯.
Noble Metal Paste貴金屬印膏.
Node節(jié)點(diǎn).
Nodule節(jié)瘤.
Nomencleature標(biāo)示文字符號.
Nominal Cured Thickness標(biāo)示厚度.
Non-Circular Land非圓形孔環(huán)焊墊.
Non-flammable非燃性.
Non-wetting不沾錫.
Normal Concentration  (Strength)標(biāo)準(zhǔn)濃度,當(dāng)量濃度.
Normal Distribution常態(tài)分布.
Novolac酯醛樹脂.
Nucleation , Nucleating核化.
Numerical Control數(shù)值控制.
Nylon尼龍.
                        *****O*****
Occlusion吸藏.
Off-Contact架空.
Offset第一面大小不均.
OFHC(Oxyen Free High Conductivity)無氧高導(dǎo)電銅.
Ohm歐姆.
Oilcanning蓋板彈動.
OLB(Outer Lead Bond)外引腳結(jié)合.
Oligomer寡聚物.
Omega Meter離子污染檢測儀.
Omega Wave振蕩波.
On-Contact Printing密貼式印刷.
Opaquer不透明劑,遮光劑.
Open Circuits斷線.
Optical Comparater光學(xué)對比器(光學(xué)放大器.)
Optical Density光密度.
Optical Inspection光學(xué)檢驗(yàn).
Optical Instrument光學(xué)儀器.
Organic Solderability Preservatives (OSP)有機(jī)保焊劑.
Osmosis滲透.
Outgassing出氣,吹氣.
Outgrowth懸出,橫出,側(cè)出.
Output產(chǎn)出,輸出.
Overflow溢流.
Overhang總懸空.
Overlap 鉆尖點(diǎn)分離.
Overpotantial(Over voltage)過電位,過電壓.
Oxidation氧化.
Oxygen Inhibitor氧化抑制劑.
Ozone Depletion臭氧層耗損.
                         *****P*****
Packaging封裝,構(gòu)裝.
Pad焊墊,圓墊.
Pad Master圓墊底片.
Pads Only Board唯墊板.
Palladium鈀.
Panel制程板.
Panel Plating全板鍍銅.
Panel Process全板電鍍法.
Paper Phenolic紙質(zhì)酚醛樹脂(板材).
Parting Agent脫膜劑.
Passivation鈍化 ,鈍化外理.
Passive Device (Component)被動組件(零件)
Paste膏,糊.
Pattern板面圖形.
Pattern Plating線路電鍍.
Pattern Process線路電鍍法.
Peak Voltage峰值電壓.
Peel Strength抗撕強(qiáng)度.
Periodic Reverse (PR) Current周期性反電流.
Peripheral周邊附屬設(shè)備.
Permeability透氣性,導(dǎo)磁率.
Permittivity誘電率,透電率.
pH Value酸堿值.
Phase相.
Phase Diagram相圖.
Phenolic酚醛樹脂.
Photofugitive感光褪色.
Photographic film感光成像之底片.
Photoinitiator感光啟始劑.
Photomask光罩.
Photoplotter, Plotter光學(xué)繪圖機(jī).
Photoresist光阻.
Photoresist Chemical Machinning (Milling)光阻式化學(xué)(銑刻)加工.
Phototool底片.
Pick and  Place拾取與放置.
Piezoelectric壓電性.
Pin 插腳,插梢,插針.
Pin Grid Array (PGA)矩陣式針腳對裝.
Pinhole針孔.
Pink Ring粉紅圈.
Pitch跨距,腳距,墊距,線距.
Pits凹點(diǎn).
Plain Weave平織.
Plasma電漿.
Plasticizers可塑劑,增塑劑.
Plated Through Hole鍍通孔.
Platen熱盤.
Plating鍍.
Plotting標(biāo)繪.
Plowing犁溝.
Plug插腳,塞柱.
Ply層,股.
Pneumatic Stretcher氣動拉伸器.
Pogo Pin伸縮探針.
Point 鉆尖.
Point Angle鉆尖面.
Point Source Light點(diǎn)狀光源.
Poise泊."粘滯度"單位=1dyne*sec/cm2.
Polar Solvent極性溶劑.
Polarity電極性.
Polarization分極,極化.
Polarizing Slot偏槽.
Polyester Films聚酯類薄片.
Polymer Thick Film (PTF)厚膜糊.
Polymerization聚合.
Polymide(PI)聚亞醯胺.
Popcorn Effect爆米花效應(yīng).
Porcelain瓷材,瓷面.
Porosity Test疏孔度試驗(yàn).
Positive Acting Resist正性光阻劑.
Post Cure后續(xù)硬化,后烤.
Post Separation后期分離,事后公離.
Pot Life運(yùn)用期,鍋中壽命.
Potting鑄封,模封.
Power Supply電源供應(yīng)器.
Preform 預(yù)制品.
Preheat預(yù)熱.
Prepreg膠片,樹脂片.
Press Plate鋼板.
Press-Fit Contact擠入式接觸.
Pressure Foot 壓力腳.
Pre-tinning預(yù)先沾錫.
Primary Image線路成像.
Print Through壓透,過度擠壓..
Probe探針.
Process Camera制程用照像機(jī).
Process Window操作范圍.
Production Master生產(chǎn)底片.
Profile輪廓,部面圖,升溫曲線圖棱線.
Propagation傳播.
Propagation Delay傳播延遲.
Puddle Effect水坑效應(yīng).
Pull Away拉離.
Pulse Plating脈沖電鍍法.
Pumice Powder 浮石粉.
Punch沖切.
Purge, Purging凈空,凈洗.
Purple Plague紫疫(金與鋁的共化物層).
Pyrolysis熱裂解,高溫分解.
                        *****Q*****
Quad Flat Pack (QFP)方扁形封裝體.
Qualification Agency資格認(rèn)證機(jī)構(gòu).
Qualification Inspection資格檢驗(yàn).
Qualified Products List合格產(chǎn)品(供應(yīng)者)名單.
Qualitative Analysis定性分析.
Quality Conformance Test Circuitry (Coupon)品質(zhì)符合之試驗(yàn)線路(樣板).
Quantitative Analysis定量分析.
Quench 淬火,驟冷.
Quick Disconnect快速接頭.
Quill緯紗繞軸.
                        *****R*****
Rack 掛架.
Radial Lead放射狀引腳.
Radio Frequency Interference (RFI)射頻干擾.
Rake Angle摳角,耙角.
Rated Temperature, Voltage額定溫度,額定電壓.
Reactance電抗.
Real Estate底材面,基板面.
Real Time System 實(shí)時(shí)系統(tǒng).
Reclaiming再生,再制.
Rediometer輻射計(jì),光度計(jì).
Reel to Reel卷輪(盤)式操作.
Reference Dimension參考尺度.
Reference Edge參考邊緣.
Reflection反射.
Reflow Soldering重熔焊接,熔焊.
Refraction折射.
Refractive Index折射率.
Register Mark對準(zhǔn)用標(biāo)記.
Registration對準(zhǔn)度.
Reinforcement補(bǔ)強(qiáng)物.
Rejection剔退,拒收.
Relamination(Re-Lam)多層板壓合.
Relaxation松弛.緩和.
Relay繼電器.
Release Agent,  Release Sheets脫模劑,離模劑.
Reliability可靠度,可信度.
Relief Angle浮角.
Repair修理.
Resin Coated Copper Foil背膠銅箔.
Resin Content膠含量,樹脂含量.
Resin Flow膠流量,樹脂流量.
Resin Recession樹脂下陷.
Resin Rich Area 多膠區(qū),樹脂豐富區(qū).
Resin Smear膠(糊)渣.
Resin Starve Area缺膠區(qū),樹脂缺乏區(qū).
Resist阻膜,阻劑.
Resistivity電阻系數(shù),電阻率.
Resistor電阻器,電阻.
Resistor Drift電阻漂移.
Resistor Paste電阻印膏.
Resolution解像,解像度,分辨率.
Resolving Power解析(像)力,分辨力.
Reverse Current Cleaning反電流(電解)清洗.
Reverse Etchback反回蝕.
Reverse Image負(fù)片影像(阻劑).
Reverse Osmosis (RO)反(逆滲透).
Reversion反轉(zhuǎn),還原.
Revision修正版.改訂版.
Rework(ing)重工,再加工.
Rhology流變學(xué),流變性質(zhì).
Ribbon Cable圓線纜帶.
Rigid-Flex Printed Board硬軟合板.
Ring 套環(huán).
Rinsing水洗,沖洗.
Ripple紋波(指整流器所輸出電流中不穩(wěn)定成分).
Rise Time上升時(shí)間.
Roadmap 線路與零件之布局圖.
Robber輔助陰極.
Roller Coating輥輪涂布.
Roller Coating滾動涂布法.
Roller Cutter輥切機(jī).
Roller Tinning輥錫法,滾錫法.
Rosin松香.
Rotary Dip Test擺動沾錫試驗(yàn).
Routing切外型.
Runout偏轉(zhuǎn),累績距差.
Rupture迸裂.
                         *****S*****
Sacrificial Protection犧牲性保護(hù)層.
Salt Spray Test鹽霧試驗(yàn).
Sand Blast噴砂.
Saponification皂化作用.
Saponifier皂化劑.
Satin Finish緞面處理.
Scaled Flow Test比例流量實(shí)驗(yàn).
Schemetic Diagram電路概略圖.
ScoringV型刻槽.
Scratch刮痕.
Screen Printing綱版印刷.
Screenability綱印能力.
Scrubber磨刷機(jī),磨刷器.
Scum透明殘膜.
Sealing封孔.
Secondary Side第二面 .
Seeding下種.
Selective Plating選擇性電鍍.
Self-Extinguishing自熄性.
Selvage布邊.
Semi-Additive Process半加成制程.
Semi-Conductor半導(dǎo)體.
Sensitizing敏化.
Separable Component Part可分離式零件.
Separator Plate隔板, 鋼板.
Sequential Lamination接續(xù)性壓合法.
Sequestering Agent螯合劑.
Shadowing陰影,回蝕死角.
Shank鉆針柄部.
Shear Strength 抗剪強(qiáng)度.
Shelf Life儲齡.
Shield遮蔽.
Shore Hardness蕭氏硬度.
Short短路.
Shoulder Angle肩斜角.
Shunt分路.
Side Wall側(cè)壁.
Siemens電阻值.
Sigma (Standard Deviation)標(biāo)準(zhǔn)差.
Signal訊號.
Silane硅烷.
Silica Gel硅膠砂.
Silicon硅.
Silicone硅銅.
Silk Screen綱版印刷,絲綱印刷.
Silver Migration銀遷移.
Silver Paste 銀膏.
Single-In-Line Package(SIP)單邊插腳封裝體.
Sintering燒結(jié).
Sizing上膠,上漿.
Sizing上漿處理.
Skin  Effect集膚效應(yīng) (高頻下,電流在傳遞時(shí)多集中在導(dǎo)體
   表面,使得道線內(nèi)部通過電流甚少, 造成內(nèi)部導(dǎo)體
浪費(fèi),并也使得表面導(dǎo)體部分電阻升高.
Skip Printing, Skip Plating漏印,漏鍍.
Skip Solder 缺錫, 漏焊.
Slashing漿經(jīng).
Sleeve Jint套接.
Sliver邊絲,邊余.
Slot, Slotting槽口.
Sludge于泥.
Slump塌散.
Slurry稠漿,懸浮漿.
Small Hole小孔.
Smear膠渣.
Smudging錫點(diǎn)沾污.
Snap-off彈回高度.
Socket插座.
Soft Contact輕觸.
Soft Glass 軟質(zhì)玻璃(鉛玻璃).
Solder焊錫.
Solder Ball錫球.
Solder Bridging錫橋.
Solder Bump 焊錫凸塊.
Solder Column Package錫柱腳封裝法.
Solder Connection焊接.
Solder Cost焊錫著層.
Solder Dam錫堤.
Solder Fillet填錫.
Solder Levelling噴錫,熱風(fēng)整平.
Solder Masking(S/M)防焊膜綠漆.
Solder Paste錫膏.
Solder Plug錫塞(柱).
Solder Preforms預(yù)焊料.
Solder Projection焊錫突點(diǎn).
Solder Sag 焊錫垂流物.
Solder Side焊錫面.
Solder Spatter濺錫.
Solder Splash賤錫.
Solder Spread Test散錫試驗(yàn).
Solder Webbing錫綱.
Solder Webbing錫綱.
Solder Wicking滲錫,焊錫之燈芯效應(yīng).
Solderability可焊性.
Soldering軟焊,焊接.
Soldering Fluid, Soldering Oil助焊液,護(hù)焊油.
Solid Content固體含量,固形分.
Solidus Line固相線.
Spacing間距.
Span跨距.
Spark Over閃絡(luò).
Specific Heat 比熱.
Specification (Spec)規(guī)范,規(guī)格.
Specimen樣品,試樣.
Spectrophotometry分光光度計(jì)檢測法.
Spindle主軸,鉆軸.
Spinning Coating自轉(zhuǎn)涂布.
Splay斜鉆孔.
Spray Coating噴著涂裝.
Spur底片圖形邊緣突出.
Sputtering濺射.
Squeege刮刀.
Stagger Grid蹣跚格點(diǎn).
Stalagometer滴管式表面張力計(jì).
Stand-off Terminals直立型端子.
Starvation缺膠.
Static Eliminator靜電消除器.
Steel Rule Die(鋼)刀模.
Stencil版膜.
Step and Repeat逐次重復(fù)曝光.
Step Plating梯階式鍍層.
Step Tablet階段式曝光表.
Stiffener補(bǔ)強(qiáng)條(板).
Stop Off防鍍膜, 阻劑.
Strain變形,應(yīng)變.
Strand絞(指由許多股單絲集束并旋扭而成的絲束).
Stray Current迷走電流, 散雜電流(在電鍍槽系統(tǒng)中,其直流電
  由整流器所提供,應(yīng)在陽極板與被鍍件之間的匯
電桿與槽體液體中流通,但有時(shí)少部分電流也可能會
從槽體本身或加熱器上迷走,漏失).
Stress Corrosion應(yīng)力腐蝕.
Stress Relief消除應(yīng)力.
Strike預(yù)鍍.
Stringing拖尾.
Stripline條線.
Stripper剝除液(器).
Substractive Process減成法.
Substrate底材.
Supper Solder超級焊錫.
Supported Hole(金屬)支助通孔.
Surface Energy表面能.
Surface Insulation Resistance表面絕緣電阻.
Surface Mount Device 表面粘裝組件.
Surface Mounting Technology (SMT)表面粘裝技術(shù).
Surface Resistivity表面電阻率.
Surface Speed鉆針表面速度.
Surface Tension表面張力.
Surfactant表面潤濕劑.
Surge突流,突壓.
Swaged Lead壓扁式引腳.
Swelling Agents, Sweller膨松劑.
Swimming 線路滑離.
Synthetic Resin合成樹脂.
                        *****T*****
Tab接點(diǎn),金手指.
Taber Abraser泰伯磨試器.
Tackiness粘著性, 粘手性.
Tape Automatic Bonding (TAB)卷帶自動結(jié)合.
Tape Casting 帶狀鑄材.
Tape Test撕膠帶試驗(yàn).
Tape Up Master原始手貼片.
Taped Components卷帶式連載組件.
Taper Pin Gauge錐狀孔規(guī).
Tarnish污化.
Tarnish 污化, 污著.
Teflon鐵氟龍(聚4氟乙烯).
Telegraphing浮印,隱印.
Temperature Profile溫度曲線.
Template模板.
Tensile Strength抗拉強(qiáng)度.
Tensiomenter張力計(jì).
Tenting蓋孔法.
Terminal端子.
Terminal Clearance端子空環(huán).
Tetra-Etch氟樹脂蝕粗劑.
Tetrafunctional Resin四功能樹脂.
Thermal Coefficient of Expansion (TCE)熱膨脹系數(shù).
Thermal Conductivity導(dǎo)熱率.
Thermal Cycling熱循環(huán),熱震蕩.
Thermal Mismstch感熱失諧.
Thermal Relief散熱式鏤空.
Thermal Via導(dǎo)熱孔.
Thermal Zone感熱區(qū).
Thermocompression Bonding熱壓結(jié)合.
Thermocouple熱電偶.
Thermode發(fā)熱體.
Thermode Soldering熱模焊接法.
Thermogravimetric Analysis, (TGA)熱重分析法.
Thermomechanical Analysis (TMA)熱機(jī)分析法.
Thermoplastic熱塑性.
Thermosetting熱固性.
Thermosonic Bonding熱超音波結(jié)合.
Thermount聚醯胺短纖席材.
Thermo-Via導(dǎo)熱孔.
Thick Film Circuit厚膜電路.
Thief輔助陽極.
Thin Copper Foil薄銅箔.
Thin Core薄基板.
Thin Film Technology薄膜技術(shù).
Thin Small Outline Package(TSOP)薄小型績體電路器.
Thinner調(diào)薄劑.
Thixotropy抗垂流性,搖變性.
Three Point Bending三點(diǎn)壓彎試驗(yàn).
Three-Layer Carrier三層式載體.
Threshold Limit Value (TLV)極限值.
Through Hole Mounting通孔插裝.
Through Put物流量,物料通過量.
Throwing Power分布力.
Tie Bar分流條.
Tin Drift錫量漂飄失.
Tin Immersion浸鍍錫.
Tin Pest錫疫(常見白色金屬錫為"β錫",當(dāng)溫度低于13.2℃
時(shí)則β錫將逐漸轉(zhuǎn)變成粉末狀灰色"α錫"稱為"錫疫".
Tin Whishers錫須.
Tinning熱沾焊錫.
Tolerance公差.
Tombstoning墓碑效應(yīng).
Tooling Feature工具標(biāo)示物.
Topography表面地形.
Torsion Strength抗扭強(qiáng)度.
Touch Up觸修,簡修.
Trace 線路,導(dǎo)線.
Traceability追溯性,可溯性.
Transducer轉(zhuǎn)能器.
Transfer Bump移用式突塊.
Transfer Laminatied Circuit轉(zhuǎn)壓式線路.
Transfer Soldering移焊法.
Transistor晶體管.
Translucency半透性.
Transmission Line傳輸線.
Transmittance透光率.
Treament, Treating含浸處理.
Treeing枝狀鍍物,鍍須.
Trim修整, 精修.
Trim Line裁切線.
Trimming修整,修邊.
True Position真位.
Tungsten鎢
Tungsten Carbide碳化鎢.
Turnkey System包辦式系統(tǒng).
Turret Solder Terminal塔立式焊接端子.
Twill Weave斜織法.
Twist板扭.
Two Layer Carrier兩層式載體.
                        *****U*****
UL Symbol(UL.為Under-Writers 保儉業(yè)試驗(yàn)所標(biāo)志.
    Laboratories,INC)
Ultimate Tensile Strength (UTS)極限抗拉強(qiáng)度.
Ultra High Frequency (UHF)超高頻率.
Ultra Violet Curing (UV Curing)紫外線硬化.
Ultrasonic Bonding超音波結(jié)合.
Ultrasonic Cleaning超音波清洗.
Ultrasonic Soldering超音波焊接.
Unbalanced Transmission Line非平衡式傳輸線.
Undercut, Undercutting側(cè)蝕.
Underplate底鍍層.
Universal Tester汛用型電測機(jī).
Unsupported Hole非鍍通孔.
Urea尿素.
Urethane胺基甲酸乙脂.
                        *****V*****
Vacuoles焊洞.
Vacuum Evaporation(or Deposition)真空蒸鍍法.
Vacuum Lamination真空壓合.
Van Der Waals Force凡得華力.
Vapor Blasting蒸汽噴砂.
Vapor Degreasing蒸汽除油法.
Vapor Phase Soldering氣相焊接.
Varnish凡力水,清漆(樹脂之液態(tài)單體).
V-cutV型切槽.
Very Large-Scale Integration(VLSI)極大績體電路器.
Via Hole 導(dǎo)通孔.
Vickers Hardness維氏硬度.
Viscosity粘滯度,粘度.
Vision Systems視覺系統(tǒng).
Visual Examination目視檢驗(yàn).
Void 破洞,空洞.
Volatile Content揮發(fā)份含量.
Voltage電壓.
Voltage Breakdown崩潰電壓.
Voltage Drop 電壓降落.
Voltage Efficiency電壓效率.
Voltage Plane電壓層.
Voltage Plane Clearance電壓層的空環(huán).
Volume Resistivity體績電阻率.
Volume Resistivity體績電阻率.
Volumetric Analysis容量分析法.
Vulcanization交聯(lián),硫化.
                        *****W*****
Wafer晶圓.
Waive暫準(zhǔn)過關(guān),暫不檢查.
Warp Size 漿經(jīng)處理.
Warp, Warpage板彎.
Washer墊圈.
Waste Treatment廢棄處理.
Water Absorption吸水性.
Water Break水膜破散,水破.
Water Mark水印.
Watt瓦特.
Watts Bath瓦茲鍍鎳液.
Wave Guide導(dǎo)波管.
Wave Soldering波焊.
Waviness 波紋,波度.
Wear Resistance耐磨性,耐磨度.
Weatherability耐候性.
Weave Eposure織紋顯露.
Weave Texture織紋隱現(xiàn).
Web蹼部.
Wedge Bond 楔形結(jié)合點(diǎn).
Wedge Void楔形缺口(破口).
Weft Yarn緯紗.
Welding熔接.
Wet Blasting濕噴砂.
Wet Lamination濕壓膜法.
Wet Process濕式制程.
Wetting Agent潤濕劑.
Wetting Balance沾錫天平.
Wetting Balance沾錫,沾濕.
Whirl Brush旋渦式磨刷法.
Whirl Coating旋渦涂布法.
Whisker晶須.
White Residue白色殘?jiān)?
White Spot白點(diǎn).
Wicking燈蕊效應(yīng).
Window操作范圍,傳動齒孔.
Wiping Action 滑動接觸(導(dǎo)電).
Wire Bonding打線結(jié)合.
Wire Gauge線規(guī).
Wire Lead金屬線腳.
Wire Pattern布線圖形.
Wire Wrap繞線互連.
Working Master工作母片.
Working Time (Life)堪用時(shí)間.
Workmanship 手藝,工藝水平,制作水準(zhǔn).
Woven Cable扁平編線.
Wrinkle皺折, 皺紋.
Wrought Foil鍛碾金屬箔.
                        *****X*****
X AxisX軸.
X-Ray X光.
X-Ray FluorescenceX螢光.
                        *****Y*****
Yarn紗線.
Y-AxisY軸.
Yield良品率,良率,產(chǎn)率.
Yield Point屈服點(diǎn).
                         *****Z*****
Z-AxisZ軸.
Zero Centering中心不變(疊合法).
Zig-Zag In-Line Package (ZIP)煉齒狀雙排腳封裝件.

=====================================================
[分享]PCB專業(yè)英譯術(shù)語
一、 綜合詞匯
1、 印制電路：printed circuit
2、 印制線路：printed wiring
3、 印制板：printed board
4、 印制板電路：printed circuit board (PCB)
5、 印制線路板：printed wiring board(PWB)
6、 印制組件：printed component
7、 印制接點(diǎn)：printed contact
8、 印制板裝配：printed board assembly
9、 板：board
10、 單面印制板：single-sided printed board(SSB)
11、 雙面印制板：double-sided printed board(DSB)
12、 多層印制板：mulitlayer printed board(MLB)
13、 多層印制電路板：mulitlayer printed circuit board
14、 多層印制線路板：mulitlayer prited wiring board
15、 剛性印制板：rigid printed board
16、 剛性單面印制板：rigid single-sided printed borad
17、 剛性雙面印制板：rigid double-sided printed borad
18、 剛性多層印制板：rigid multilayer printed board
19、 撓性多層印制板：flexible multilayer printed board
20、 撓性印制板：flexible printed board
21、 撓性單面印制板：flexible single-sided printed board
22、 撓性雙面印制板：flexible double-sided printed board
23、 撓性印制電路：flexible printed circuit (FPC)
24、 撓性印制線路：flexible printed wiring
25、 剛性印制板：flex-rigid printed board, rigid-flex printed board
26、 剛性雙面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed
27、 剛性多層印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board
28、 齊平印制板：flush printed board
29、 金屬芯印制板：metal core printed board
30、 金屬基印制板：metal base printed board
31、 多重布線印制板：mulit-wiring printed board
32、 陶瓷印制板：ceramic substrate printed board
33、 導(dǎo)電膠印制板：electroconductive paste printed board
34、 模塑電路板：molded circuit board
35、 模壓印制板：stamped printed wiring board
36、 順序?qū)訅憾鄬佑≈瓢澹簊equentially-laminated mulitlayer
37、 散線印制板：discrete wiring board
38、 微線印制板：micro wire board
39、 積層印制板：buile-up printed board
40、 積層多層印制板：build-up mulitlayer printed board (BUM)
41、 積層撓印制板：build-up flexible printed board
42、 表面層合電路板：surface laminar circuit (SLC)
43、 埋入凸塊連印制板：B2it printed board
44、 多層膜基板：multi-layered film substrate(MFS)
45、 層間全內(nèi)導(dǎo)通多層印制板：ALIVH multilayer printed board
46、 載芯片板：chip on board (COB)
47、 埋電阻板：buried resistance board
48、 母板：mother board
49、 子板：daughter board
50、 背板：backplane
51、 裸板：bare board
52、 鍵盤板夾心板：copper-invar-copper board
53、 動態(tài)撓性板：dynamic flex board
54、 靜態(tài)撓性板：static flex board
55、 可斷拼板：break-away planel
56、 電纜：cable
57、 撓性扁平電纜：flexible flat cable (FFC)
58、 薄膜開關(guān)：membrane switch
59、 混合電路：hybrid circuit
60、 厚膜：thick film
61、 厚膜電路：thick film circuit
62、 薄膜：thin film
63、 薄膜混合電路：thin film hybrid circuit
64、 互連：interconnection
65、 導(dǎo)線：conductor trace line
66、 齊平導(dǎo)線：flush conductor
67、 傳輸線：transmission line
68、 跨交：crossover
69、 板邊插頭：edge-board contact
70、 增強(qiáng)板：stiffener
71、 基底：substrate
72、 基板面：real estate
73、 導(dǎo)線面：conductor side
74、 組件面：component side
75、 焊接面：solder side
76、 印制：printing
77、 網(wǎng)格：grid
78、 圖形：pattern
79、 導(dǎo)電圖形：conductive pattern
80、 非導(dǎo)電圖形：non-conductive pattern
81、 字符：legend
82、 標(biāo)志：mark
[/size]
作者：ilww 2004-11-10 16:18:00)

二、 基材：
1、 基材：base material
2、 層壓板：laminate
3、 覆金屬箔基材：metal-clad bade material
4、 覆銅箔層壓板：copper-clad laminate (CCL)
5、 單面覆銅箔層壓板：single-sided copper-clad laminate
6、 雙面覆銅箔層壓板：double-sided copper-clad laminate
7、 復(fù)合層壓板：composite laminate
8、 薄層壓板：thin laminate
9、 金屬芯覆銅箔層壓板：metal core copper-clad laminate
10、 金屬基覆銅層壓板：metal base copper-clad laminate
11、 撓性覆銅箔絕緣薄膜：flexible copper-clad dielectric film
12、 基體材料：basis material
13、 預(yù)浸材料：prepreg
14、 粘結(jié)片：bonding sheet
15、 預(yù)浸粘結(jié)片：preimpregnated bonding sheer
16、 環(huán)氧玻璃基板：epoxy glass substrate
17、 加成法用層壓板：laminate for additive process
18、 預(yù)制內(nèi)層覆箔板：mass lamination panel
19、 內(nèi)層芯板：core material
20、 催化板材：catalyzed board ,coated catalyzed laminate
21、 涂膠催化層壓板：adhesive-coated catalyzed laminate
22、 涂膠無催層壓板：adhesive-coated uncatalyzed laminate
23、 粘結(jié)層：bonding layer
24、 粘結(jié)膜：film adhesive
25、 涂膠粘劑絕緣薄膜：adhesive coated dielectric film
26、 無支撐膠粘劑膜：unsupported adhesive film
27、 覆蓋層：cover layer (cover lay)
28、 增強(qiáng)板材：stiffener material
29、 銅箔面：copper-clad surface
30、 去銅箔面：foil removal surface
31、 層壓板面：unclad laminate surface
32、 基膜面：base film surface
33、 膠粘劑面：adhesive faec
34、 原始光潔面：plate finish
35、 粗面：matt finish
36、 縱向：length wise direction
37、 模向：cross wise direction
38、 剪切板：cut to size panel
39、 酚醛紙質(zhì)覆銅箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
40、 環(huán)氧紙質(zhì)覆銅箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
41、 環(huán)氧玻璃布基覆銅箔板：epoxide woven glass fabric copper-clad laminates
42、 環(huán)氧玻璃布紙復(fù)合覆銅箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
43、 環(huán)氧玻璃布玻璃纖維復(fù)合覆銅箔板：epoxide non woven/woven glass reinforced copper-clad laminates
44、 聚酯玻璃布覆銅箔板：ployester woven glass fabric copper-clad laminates
45、 聚酰亞胺玻璃布覆銅箔板：polyimide woven glass fabric copper-clad laminates
46、 雙馬來酰亞胺三嗪環(huán)氧玻璃布覆銅箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
47、 環(huán)氧合成纖維布覆銅箔板：epoxide synthetic fiber fabric copper-clad laminates
48、 聚四乙烯玻璃纖維覆銅箔板：teflon/fiber glass copper-clad laminates
49、 超薄型層壓板：ultra thin laminate
50、 陶瓷基覆銅箔板：ceramics base copper-clad laminates
51、 紫外線阻擋型覆銅箔板：UV blocking copper-clad laminates
作者：ilww 2004-11-10 16:19:00)

三、 基材的材料
1、 A階樹脂：A-stage resin
2、 B階樹脂：B-stage resin
3、 C階樹脂：C-stage resin
4、 環(huán)氧樹脂：epoxy resin
5、 酚醛樹脂：phenolic resin
6、 聚酯樹脂：polyester resin
7、 聚酰亞胺樹脂：polyimide resin
8、 雙馬來酰亞胺三嗪樹脂：bismaleimide-triazine resin
9、 丙烯酸樹脂：acrylic resin
10、 三聚氰胺甲醛樹脂：melamine formaldehyde resin
11、 多官能環(huán)氧樹脂：polyfunctional epoxy resin
12、 溴化環(huán)氧樹脂：brominated epoxy resin
13、 環(huán)氧酚醛：epoxy novolac
14、 氟樹脂：fluroresin
15、 硅樹脂：silicone resin
16、 硅烷：silane
17、 聚合物：polymer
18、 無定形聚合物：amorphous polymer
19、 結(jié)晶現(xiàn)象：crystalline polamer
20、 雙晶現(xiàn)象：dimorphism
21、 共聚物：copolymer
22、 合成樹脂：synthetic
23、 熱固性樹脂：thermosetting resin
24、 熱塑性樹脂：thermoplastic resin
25、 感旋光性樹脂：photosensitive resin
26、 環(huán)氧當(dāng)量：weight per epoxy equivalent (WPE)
27、 環(huán)氧值：epoxy value
28、 雙氰胺：dicyandiamide
29、 粘結(jié)劑：binder
30、 膠粘劑：adesive
31、 固化劑：curing agent
32、 阻燃劑：flame retardant
33、 遮光劑：opaquer
34、 增塑劑：plasticizers
35、 不飽和聚酯：unsatuiated polyester
36、 聚酯薄膜：polyester
37、 聚酰亞胺薄膜：polyimide film (PI)
38、 聚四氟乙烯：polytetrafluoetylene (PTFE)
39、 聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)
40、 增強(qiáng)材料：reinforcing material
41、 玻璃纖維：glass fiber
42、 E玻璃纖維：E-glass fibre
43、 D玻璃纖維：D-glass fibre
44、 S玻璃纖維：S-glass fibre
45、 玻璃布：glass fabric
46、 非織布：non-woven fabric
47、 玻璃纖維墊：glass mats
48、 紗線：yarn
49、 單絲：filament
50、 絞股：strand
51、 緯紗：weft yarn
52、 經(jīng)紗：warp yarn
53、 但尼爾：denier
54、 經(jīng)向：warp-wise
55、 緯向：weft-wise, filling-wise
56、 織物經(jīng)緯密度：thread count
57、 織物組織：weave structure
58、 平紋組織：plain structure
59、 壞布：grey fabric
60、 稀松織物：woven scrim
61、 弓緯：bow of weave
62、 斷經(jīng)：end missing
63、 缺緯：mis-picks
64、 緯斜：bias
65、 折痕：crease
66、 云織：waviness
67、 魚眼：fish eye
68、 毛圈長：feather length
69、 厚薄段：mark
70、 裂縫：split
71、 捻度：twist of yarn
72、 浸潤劑含量：size content
73、 浸潤劑殘留量：size residue
74、 處理劑含量：finish level
75、 浸潤劑：size
76、 偶聯(lián)劑：couplint agent
77、 處理織物：finished fabric
78、 聚酰胺纖維：polyarmide fiber
79、 聚酯纖維非織布：non-woven polyester fabric
80、 浸漬絕緣縱紙：impregnating insulation paper
81、 聚芳酰胺纖維紙：aromatic polyamide paper
82、 斷裂長：breaking length
83、 吸水高度：height of capillary rise
84、 濕強(qiáng)度保留率：wet strength retention
85、 白度：whitenness
86、 陶瓷：ceramics
87、 導(dǎo)電箔：conductive foil
88、 銅箔：copper foil
89、 電解銅箔：electrodeposited copper foil (ED copper foil)
90、 壓延銅箔：rolled copper foil
91、 退火銅箔：annealed copper foil
92、 壓延退火銅箔：rolled annealed copper foil (RA copper foil)
93、 薄銅箔：thin copper foil
94、 涂膠銅箔：adhesive coated foil
95、 涂膠脂銅箔：resin coated copper foil (RCC)
96、 復(fù)合金屬箔：composite metallic material
97、 載體箔：carrier foil
98、 殷瓦：invar
99、 箔（剖面）輪廓：foil profile
100、 光面：shiny side
101、 粗糙面：matte side
102、 處理面：treated side
103、 防銹處理：stain proofing
104、 雙面處理銅箔：double treated foil
作者：ilww 2004-11-10 16:20:00)

四、 設(shè)計(jì)
1、 原理圖：shematic diagram
2、 邏輯圖：logic diagram
3、 印制線路布設(shè)：printed wire layout
4、 布設(shè)總圖：master drawing
5、 可制造性設(shè)計(jì)：design-for-manufacturability
6、 計(jì)算機(jī)輔助設(shè)計(jì)：computer-aided design.(CAD)
7、 計(jì)算機(jī)輔助制造：computer-aided manufacturing.(CAM)
8、 計(jì)算機(jī)集成制造：computer integrat manufacturing.(CIM)
9、 計(jì)算機(jī)輔助工程：computer-aided engineering.(CAE)
10、 計(jì)算機(jī)輔助測試：computer-aided test.(CAT)
11、 電子設(shè)計(jì)自動化：electric design automation .(EDA)
12、 工程設(shè)計(jì)自動化：engineering design automaton .(EDA2)
13、 組裝設(shè)計(jì)自動化：assembly aided architectural design. (AAAD)
14、 計(jì)算機(jī)輔助制圖：computer aided drawing
15、 計(jì)算機(jī)控制顯示：computer controlled display .(CCD)
16、 布局：placement
17、 布線：routing
18、 布圖設(shè)計(jì)：layout
19、 重布：rerouting
20、 模擬：simulation
21、 邏輯模擬：logic simulation
22、 電路模擬：circit simulation
23、 時(shí)序模擬：timing simulation
24、 模塊化：modularization
25、 布線完成率：layout effeciency
26、 機(jī)器描述格式：machine descriptionm format .(MDF)
27、 機(jī)器描述格式數(shù)據(jù)庫：MDF databse
28、 設(shè)計(jì)數(shù)據(jù)庫：design database
29、 設(shè)計(jì)原點(diǎn)：design origin
30、 優(yōu)化（設(shè)計(jì)）：optimization (design)
31、 供設(shè)計(jì)優(yōu)化坐標(biāo)軸：predominant axis
32、 表格原點(diǎn)：table origin
33、 鏡像：mirroring
34、 驅(qū)動文件：drive file
35、 中間文件：intermediate file
36、 制造文件：manufacturing documentation
37、 隊(duì)列支撐數(shù)據(jù)庫：queue support database
38、 組件安置：component positioning
39、 圖形顯示：graphics dispaly
40、 比例因子：scaling factor
41、 掃描填充：scan filling
42、 矩形填充：rectangle filling
43、 填充域：region filling
44、 實(shí)體設(shè)計(jì)：physical design
45、 邏輯設(shè)計(jì)：logic design
46、 邏輯電路：logic circuit
47、 層次設(shè)計(jì)：hierarchical design
48、 自頂向下設(shè)計(jì)：top-down design
49、 自底向上設(shè)計(jì)：bottom-up design
50、 線網(wǎng)：net
51、 數(shù)字化：digitzing
52、 設(shè)計(jì)規(guī)則檢查：design rule checking
53、 走（布）線器：router (CAD)
54、 網(wǎng)絡(luò)表：net list
55、 計(jì)算機(jī)輔助電路分析：computer-aided circuit analysis
56、 子線網(wǎng)：subnet
57、 目標(biāo)函數(shù)：objective function
58、 設(shè)計(jì)后處理：post design processing (PDP)
59、 交互式制圖設(shè)計(jì)：interactive drawing design
60、 費(fèi)用矩陣：cost metrix
61、 工程圖：engineering drawing
62、 方塊框圖：block diagram
63、 迷宮：moze
64、 組件密度：component density
65、 巡回售貨員問題：traveling salesman problem
66、 自由度：degrees freedom
67、 入度：out going degree
68、 出度：incoming degree
69、 曼哈頓距離：manhatton distance
70、 歐幾里德距離：euclidean distance
71、 網(wǎng)絡(luò)：network
72、 陣列：array
73、 段：segment
74、 邏輯：logic
75、 邏輯設(shè)計(jì)自動化：logic design automation
76、 分線：separated time
77、 分層：separated layer
78、 定順序：definite sequenc
作者：ilww 2004-11-10 16:21:00)

五、 形狀與尺寸：
1、 導(dǎo)線（信道）：conduction (track)
2、 導(dǎo)線（體）寬度：conductor width
3、 導(dǎo)線距離：conductor spacing
4、 導(dǎo)線層：conductor layer
5、 導(dǎo)線寬度/間距：conductor line/space
6、 第一導(dǎo)線層：conductor layer No.1
7、 圓形盤：round pad
8、 方形盤：square pad
9、 菱形盤：diamond pad
10、 長方形焊盤：oblong pad
11、 子彈形盤：bullet pad
12、 淚滴盤：teardrop pad
13、 雪人盤：snowman pad
14、 V形盤：V-shaped pad
15、 環(huán)形盤：annular pad
16、 非圓形盤：non-circular pad
17、 隔離盤：isolation pad
18、 非功能連接盤：monfunctional pad
19、 偏置連接盤：offset land
20、 腹（背）裸盤：back-bard land
21、 盤址：anchoring spaur
22、 連接盤圖形：land pattern
23、 連接盤網(wǎng)格陣列：land grid array
24、 孔環(huán)：annular ring
25、 組件孔：component hole
26、 安裝孔：mounting hole
27、 支撐孔：supported hole
28、 非支撐孔：unsupported hole
29、 導(dǎo)通孔：via
30、 鍍通孔：plated through hole (PTH)
31、 余隙孔：access hole
32、 盲孔：blind via (hole)
33、 埋孔：buried via hole
34、 埋/盲孔：buried /blind via
35、 任意層內(nèi)部導(dǎo)通孔：any layer inner via hole (ALIVH)
36、 全部鉆孔：all drilled hole
37、 定位孔：toaling hole
38、 無連接盤孔：landless hole
39、 中間孔：interstitial hole
40、 無連接盤導(dǎo)通孔：landless via hole
41、 引導(dǎo)孔：pilot hole
42、 端接全隙孔：terminal clearomee hole
43、 準(zhǔn)表面間鍍覆孔：quasi-interfacing plated-through hole
44、 準(zhǔn)尺寸孔：dimensioned hole
45、 在連接盤中導(dǎo)通孔：via-in-pad
46、 孔位：hole location
47、 孔密度：hole density
48、 孔圖：hole pattern
49、 鉆孔圖：drill drawing
50、 裝配圖：assembly drawing
51、 印制板組裝圖：printed board assembly drawing
52、 參考基準(zhǔn)：datum referan